The homogeneity of adhesive layers, which is not visible or accessible after the joining process of the components, should often be tested. The modern technique of Photoacoustic Imaging provides a solution in such cases. For example you can see here (b) errors in the adhesive layer between (a) a non-transparent plastic component and a metal component – and (c) the adhesive surface in a PAI-Scan.
Online quality assurance during the welding process
With our patented Laser Ultrasonics technology we are able to understand the welding seam inspection inline in all welding processes. Through integrated and contactless measurements (that allow high-resolution measurements on the hot weld), the testing of the welding seam is completed within seconds after the welding has been done.
The Laser Ultrasonics technology is also applicable for the testing of adhesion and bonding layers, e.g., solder joints. As the high-frequency ultrasonic waves are influenced at the interfaces, an image of this critical inner zone can be generated.
Hidden (adhesive-) layers
With the Terahertz technology (THz) it is possible to look through relatively thick plastic layers and test hidden layers non-destructively (e.g. adhesive layers). The terahertz waves used are not harmful for health (no ionizing radiation), but still make it possible to look inside many optically non-transparent materials.
Multilayer systems and welding seams in polymer films
Multilayer-films carry great importance especially in the food industry. For example, the thickness and homogeneity of barrier layers have a great influence on the shelf-life of food. With the OCT technology you can measure the thickness of the individual layers with high-resolution inline during the process. Moreover, you can see and detect delaminations and welding seams in real-time and possibly regulate and optimize the production process based on this measurement data.
Adhesive bonding processes
An adhesive bond can only be as good as the production process in which it was produced. Besides the optimum choice and quality of the adhesive agent, the preparation of the surfaces and the perfect process control also play important roles in ensuring utmost performance of the bond in terms of load capacity and fatigue strength.
By utilizing spectroscopic technologies we can help you to monitor and control all chemical parameters (e.g., in mixtures, reaction monitoring, cleanliness of surfaces, hardening) directly inline during the process.
Spatially resolved spectroscopy
Do you want to know the exact local distribution (in micrometer range) of your chemical components? With Mid-Infrared-Microscopy we can chemically characterize and measure materials and cross-sections (e.g. residues or inclusions) with a spatial resolution as small as 5 µm.