
Testing of metals, polymers, semiconductors, ceramics, composites, etc.
Testing of highly specific samples (hot, cold, dangerous, very sensitive, small etc.)
Detection of delaminations - e.g. in composites/CFRP, silicon wafers, coatings, adhesive bonds
Non-destructive evaluation of bonded joints
Quality control of welds and spot welds
Detection and imaging of defects under the surface of various materials

Holzer Robert, Dipl.-Ing.
Project Management & Business Development
+43 (732) 2468 - 4602
+43 (664) 965 8927
robert.holzer@recendt.at