FIEsys

FIEsys

Fast Imaging Extension for Terahertz Systems

With FIEsys, you can expand your terahertz (THz) system with a fast and precise imaging unit. It is based on the THz system “TeraFlash smart” and the imaging unit “Flexible Imaging Extension” from TOPTICA (https://www.toptica.com). By combining it with our FIEsys extension (consisting of the “FIEsync” module and the "FIEpack" software), the full repetition rate of the “TeraFlash smart” system of 1600 THz pulse traces/second can be used for imaging.

Together with our partner TOPTICA, we can thus offer a complete terahertz system for flexible and fast imaging, consisting of the following components:

  • „TeraFlash smart“ from TOPTICA: terhertz system
  • „Flexible Imaging Extension“ from TOPTICA: imaging unit
  • FIEsync from RECENDT: synchronization module between THz system and imaging unit
  • FIEpack from RECENDT: software with user interface for data recording, evaluation, and visualization

You are also welcome to expand your existing terahertz system with FIEsys and optimize your imaging - get in touch with us!

Technical Features
Imaging unit
Measurement principle stationary sample/moving sensor head
reflection measurement
Maximum imaging area 300 x 300 mm
Accuracy 65 µm
Measurement speed > 1mm/s bis 280 mm/s
Resolution @ 1600 time traces / second 0.175 mm @ 280 mm/s
FIEsync hardware specification
Power supply USB (5 V, max. 300 mW)
Dimensions 106 x 102 x 35 mm
Weight 190 g
Operating conditions 10°C - 70°C
Protection class IP20
FIEpack software
Features setting up the scanning area
data acqusition
data evaluation
data visualization in realtime
   

 

Application: Fast and Precise THz Imaging

Data visualization in realtime
A scan (time signal and amplitude spectrum) B scan (time signal over scanning line)
C scan (maximum amplitude over scanning area)

 

Examples of applications
  • Detection of production faults
  • Detection of foreign objects/contaminants
  • Inspection of fiber orientation and anisotropy in composites (CFRP/GFRP)
  • Inspection of bonding areas
  • Inspection of semiconductor products
  • Chemical imaging (chemical characterization in the THz spectrum)
  • 3D tomography (on request)
  • ... we look forward to your inquiry!
Examples

 

Imaging of defects in GFRP

Imaging of bonding interfaces (e.g. metal - GFRP)
Terahertz hyperspectral imaging

 

 

Inquiry

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Holzer Robert, Dipl.-Ing. -

Holzer Robert, Dipl.-Ing.
Project Management & Business Development

Zerobin Stefan, Dipl.-Ing. Dr. -

Zerobin Stefan, Dipl.-Ing. Dr.
Business Development Manager (actual paternity leave)