Material Characterization & Product Inspection

Using laser ultrasonic technology, we can examine the characteristic properties of the microstructure of samples and the quality properties of metal components in a non-contact and non-destructive manner, without having to prepare or cut the sample or component. The measurement can be carried out either in situ during the thermal treatment of the sample or ex situ on the finished component.

For in situ investigations during thermal treatment, our laboratory has a quenching and forming dilatometer from Linseis (type DIL L78/RITA Q/D/T), which we have expanded in cooperation with Linseis to include our specially developed MetProLUS laser ultrasound system. This allows the investigation of temperature-dependent changes in the microstructure of the sample and, depending on the sample geometry, also of the elastic properties of the material in real time simultaneously with the dilatometer investigations.

Compared to current standard methods in semiconductor technology (e.g., acoustic microscopy (C-SAM)), local acoustic spectroscopy can also be used to measure material-specific parameters and elastic phenomena in different materials and thin films up to high frequency ranges in a non-contact and non-destructive manner. Our specially developed laser ultrasound method (see also our FreDomLUS product) provides spatially resolved imaging of a wide range of parameters that influence wave propagation in the material, such as dimensional or elastic properties.

Application examples:

• Detection of delamination in wafers, etc.
• Characterization of filter materials for e.g. RF filters (such as BAW or FBAR filters)
• Characterization of thin films and film systems (µm to nm)
• Characterization of microelectromechanical systems (MEMS)
• Investigation of piezoelectric materials

The quality of a coating significantly influence the functionality of a product or component. Knowledge of characteristic properties such as layer thickness or quality features such as the homogeneity of the applied coating is essential. Not only the layer itself, but also the connection to the substrate or to other layers is of great importance. Delamination should be avoided. With our technologies, non-metallic coatings and layer structures on a wide variety of substrate materials can be investigated in high resolution.

Application examples:

• Paints (polyamide, acrylic, etc.)
• Polymer coatings
• Ceramic coatings
• Glass coatings
• Coating of tablets
• Multilayer structures
• Single-layer and multilayer films
• Plates and laminates
• Lens systems
• Semiconductor products

Look beneath the surface of your sample! Our technologies give you insight into the internal structure, allowing you to determine important properties and quality characteristics of your sample in a non-contact and non-destructive manner. We are able to inspect and characterize all non-metallic material structures (from transparent/semi-transparent materials to plastics, ceramics, glass, and biological samples) in our laboratories.

Application examples:

• Injection molded parts
• Filled polymers
• Foam structures
• Powders
• Paper/cardboard
• Fabric samples

Depending on the choice of material and application, the structure of a composite material can vary greatly (e.g., laminate composite, structural composite, fiber composite, particle composite, etc.). The structure is decisive for the strength, integrity, and functionality of the material in its application. With our non-destructive and non-contact measurement methods, we are able to detect and characterize characteristic structural properties as well as different types of defects in the composite material. Thanks to the high axial resolution and large penetration depth, defects inside the material (like delamination) can also be detected in deep layers.

Application examples:

• Detection of production defects
• Detection of impacts
• Support in material development

We use laser ultrasound to inspect soldered and welded joints in a non-contact and non-destructive manner. This technology is particularly important when standardized testing (for welded joints in accordance with DIN EN ISO 5817, DIN EN ISO 10042 and DIN EN ISO 17635) is not applicable (e.g. in the case of very small battery weld seams) or when additional information is required to assess the quality of the soldered or welded joint.

Depending on the requirements, scanning the area of interest provides a high-resolution imaging of the zones with actual material bonding. This allows the bonding quality to be assessed at different depths or layers of the material and defects or discontinuities to be detected. Regardless of the soldering or welding process (applicable to soft- and hard-soldering, arc-, gas fusion-, press-, resistance-, and beam-welding), even the smallest discontinuities (e.g., zinc spots) can be visualized and characterized thanks to the high bandwidth of the measurement system's test frequencies.

Application examples:

• Battery production
• Car body manufacturing
• Multi-sheet metal welded joints
• Wire-arc-additive-manufacturing (WAAM)